Category:
Other Fine Chemicals
CAS NO:
N/A
Standard:
ChP,
Product Information
Brand |
Epoxy equivalent g/eq |
Hydrolysab le chlorine, wt% ≤ |
Inorgano- chlorine, wt% ≤ |
Softening point ℃ |
Volatile wt%≤ |
Color (Gardner) ≤ |
CYDCN-208 |
200~215 |
0.015 |
0.0005 |
80~95 |
0.15 |
2 |
CYDCN-200 |
195~210 |
0.015 |
0.0005 |
60~75 |
0.1 |
2 |
Due to the multi-epoxy groups existing in the molecules of O-cresol formaldehyde epoxy resin, a large amountoftight cross-bonds areformed after being cured, resulting in excellent thermalstability, mechanical strength, electricity insulation and chemicals resistance. It is mainly used in microelectronic industry. Widely used for the encapsulant of semiconductors and integrated circuits.