fluorene-9-bisphenol

Appearance :   White powder
Molecular Formula :   C25H18O2
Molecular Weight  :  350.4092
CAS No :  3236-71-3
EINECS NO :   207-630-7  
Density :   1.288g/cm
Melting point :   224-226℃
Boiling point :   526.4°C（760mmHg）
Flash point :   241°C
Application:
1) As a modifier of epoxy resin, bisphenol fluorene has higher rigidity and higher heat resistance, and is widely used in aircraft structures and missile warheads.
2) used in new heat-resistant polycarbonate (PC), engineering plastics, aerospace, medical, communications and other fields.
3) used to produce polyether products, polyester products.
4) Photoconductor, polymer, photoconductor, heat transfer, flame retardant resin, radiation protection polymer, thermoplastic resin, electrical conductor insulator, engine slot liner and high temperature resistant coating as photoelectric properties.
5) Bisphenol fluorene polymer, can be used as a sandwich insulator coating for the protection of microelectronic circuits.